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Laser cutting machine achievements LED lighting

  Laser cutting machine in the LED industry, LED lighting industry will bring new meaning, LED light source to replace the traditional light source, energy consumption can be reduced by at least 50%.
  With the introduction of national energy conservation policies, the traditional incandescent lamp must withdraw from the stage of history. At the same time, LED lighting products technology matures, in the context of energy saving and environmental protection and the government's strong publicity, will be favorable for the popularization and promotion. The laser technology in the LED industry, LED lighting industry will bring new meaning. LED light source to replace the traditional light source, energy consumption can be reduced by at least 50%.
  Here to introduce several LED industry to promote the development of high-quality laser cutting machine.
  LED sapphire substrate automatic ultra fast laser cutting machine
  The device is a LED sapphire substrate (see below) laser cutting automatic processing station, with automatic loading and unloading system, significantly reduce labor costs and improve production efficiency. In the high stability and high yield, while ensuring a better operability and ease of use.
  Automatic loading and unloading, reduce labor costs, improve production efficiency;
  Equipped with imported ultra-fast laser, the use of Chinese laborers intellectual property rights laser focusing system, beam quality and stability, cutting effect is good;
  With optical marble platform, high-speed high-precision linear motor, negative pressure adsorption system and professional cutting control software, processing speed, high yield;
  Coaxial CCD auxiliary monitoring system, with coaxial imaging alignment function and coaxial distance measurement function, user-friendly interface, high operating efficiency.

  LED ultraviolet laser dicing machine
  LED ultraviolet laser dicing machine using high-quality ultraviolet laser, high-precision workstations, its unique optical design can facilitate the bit, real-time observation of the CCD image processing system to meet the epitaxial wafer high-speed, high-quality cutting requirements. The cutting system is suitable for cutting of LED sapphire substrate epitaxial wafers. Products with high positioning accuracy, focusing spot small, CCD coaxial monitoring cutting characteristics, to meet the LED sapphire substrate epitaxial wafer cutting process requirements.
High - precision linear motion platform, marble base bearing table, adjustable focal length;
  CCD coaxial monitoring, to achieve automatic image recognition and automatic positioning cutting;
  Beam quality is good, the cutting process without mechanical stress, effectively reduce the chip back collapse and micro-cracks;
  The average trouble-free use of up to 100,000 hours, electro-optical conversion efficiency, low power equipment, long-term use for users to save a lot of energy expenditure;
  LED sapphire substrate ultra fast laser cutting machine
  LED sapphire substrate (see below) Ultra-fast laser cutting machine is a LED sapphire substrate cutting exclusive equipment, combined with years of research and development of sapphire cutting technology and industrial design experience, with coaxial imaging and coaxial distance measurement function , In the high stability and high yield, while ensuring a better operability and ease of use.
  Equipped with imported ultra-fast laser, the use of Chinese laborers intellectual property rights laser focusing system, beam quality and stability, cutting effect is good;
  With optical marble platform, high-speed high-precision linear motor, negative pressure adsorption system and professional cutting control software, processing speed, high yield;
  Coaxial CCD auxiliary monitoring system, with coaxial imaging alignment function and coaxial distance measurement function, user-friendly interface, high operating efficiency.