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Laser surface treatment with laser marking contact

  • Author:Jessica
  • Release on :2017-07-12
  In the field of wide range of industrial laser material processing, laser surface processing and the term is often used to describe a series of using continuous wave (the CW), a kw power source of near infrared laser processing activities.However, the above techniques are completely different from the techniques described in this paper for the application of micron and nanoscale surfaces.Many processes of short pulse picosecond (10-12) and femtosecond (10-15) superfast lasers have been established and many related content is published.
  The main drawback of these processes is that even the low-power series of products that belong to these types of lasers are still very expensive to invest and run.Because the speed of processing usually depends on the average power of the laser, for most industrial laser users, laser processing costs may be too high for the actual surface coverage.
  Recently, the pulse width of a mature nanosecond pulse fiber laser has been extended to the sub-second level, with a peak power capacity of orders of magnitude increased.This makes it possible to develop a new laser surface processing technology that USES a cost-effective long picosecond laser source.
  Although these technologies are often referred to as the laser surface treatment, from the mechanical point of view, the process is closely related to laser marking, because they are limited to the surface of parts processing, usually need to combine with laser ablation and melting process.Figure 1 attempts to classify this wide range of processes using the industry's widely accepted terms and the major physical mechanisms involved.
  The advantages of optical fiber lasers are known to ensure that they are the dominant choice in most applications shown in figure 1.Here we mainly introduce the content is in order to improve the understanding of the micron level laser application, this type of laser used for generally considered difficult to adopt standard infrared wavelengths of target materials, such as copper and glass roughen the surface of processing or marking application.